View RMDA1840_278964.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

RMDA1840
18-40 GHz Broad Band Driver Amplifier MMIC PRODUCT INFORMATION
Description
The RMDA1840 is a 4-stage GaAs MMIC amplifier designed as a 18 to 40 GHz broad band amplifier for use in point to point radios, point to multi-point communications, LMDS, and other millimeter wave applications. The RMDA1840 utilizes Raytheon's 0.25m power PHEMT process and is sufficiently versatile to serve in a variety of applications, such as a driver amplifier or a frequency multiplier. 4 mil substrate Small-signal gain 22 dB (typ.) Pout 1 dB comp 23 dBm (typ.) Chip size 4.67 mm x 2.00 mm
Features
Absolute Maximum Ratings
Parameter Positive DC voltage (+5 V Typical) Negative DC voltage Simultaneous (Vd - Vg) Positive DC Current RF Input Power (from 50 source) Operating Baseplate Temperature Storage Temperature Range Thermal Resistance
(Channel to Backside)
Symbol Vd Vg Vdg ID PIN TC Tstg RJC
Value +6 -2 +8 442 +15 -30 to +85 -55 to +125 53
Units Volts Volts Volts mA dBm C C C/W
Electrical Characteristics
(At 25C), 50 system, Vd = +5 V, Quiescent Current Idq = 400 mA
Parameter Frequency Range Gate Supply Voltage (Vg)1 Gain Small Signal at Pin = -5 dBm Gain Variation vs Frequency Gain at 1dB Compression Power Output at 1 dB Compression
Min 18
Typ -0.2
Max Unit 40 GHz V dB dB dB dBm
Parameter Power Output Saturated: Pin = +3 dBm Power Added Efficiency (PAE): at P1dB Input Return Loss (Pin = -5 dBm) Output Return Loss (Pin = -5 dBm)
Min 21
Typ 24 15 8 10
Max Unit dBm % dB dB
20
22 +/-2.5 21 23
Notes: 1. Typical range of gate voltage is -1.0 to 0 V to set Idq of 400 mA. Characteristic performance data and specifications are subject to change without notice. www.raytheon.com/micro Revised January 15, 2001 Page 1 Raytheon RF Components 362 Lowell Street Andover, MA 01810
RMDA1840
18-40 GHz Broad Band Driver Amplifier MMIC PRODUCT INFORMATION
Application Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE. Chip carrier material should be selected to have GaAs compatible thermal coefficient of expansion and high thermal conductivity such as copper molybdenum or copper tungsten. The chip carrier should be machined, finished flat, plated with gold over nickel and should be capable of withstanding 325C for 15 minutes. Die attachment should utilize Gold/Tin (80/20) eutectic alloy solder and should avoid hydrogen environment for PHEMT devices. Note that the backside of the chip is gold plated and is used as RF ground. These GaAs devices should be handled with care and stored in dry nitrogen environment to prevent contamination of bonding surfaces. These are ESD sensitive devices and should be handled with appropriate precaution including the use of wrist grounding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. Recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical allowing for appropriate stress relief. The RF input and output bonds should be typically 0.012" long corresponding to a typically 2 mil between the chip and the substrate material. CAUTION: THIS IS AN ESD SENSITIVE DEVICE. CAUTION: LOSS OF GATE VOLTAGES (Vg) WHILE DRAIN VOLTAGES (Vd) IS PRESENT MAY DAMAGE THE AMPLIFIER CHIP. The following sequence of steps must be followed to properly test the amplifier. Step 1: Turn off RF input power. Step 5: After the bias condition is established, RF input signal may now be applied at the appropriate Step 2: Connect the DC supply grounds to the grounds frequency band. of the chip carrier. Slowly apply negative gate bias supply voltage of -1.5 V to Vg. Step 6: Follow turn-off sequence of: Step 3: Slowly apply positive drain bias supply voltage (i) Turn off RF input power, of +5 V to Vd. (ii) Turn down and off drain voltage (Vd), Step 4: Adjust gate bias voltage to set the quiescent (iii) Turn down and off gate bias voltage (Vg). current of Idq = 400 mA.
Recommended Procedure
for Biasing and Operation
Figure 1 Functional Block Diagram
Drain Supply Drain Supply Vd1 Vd2
Drain Supply Vd3
Drain Supply Vd4
MMIC Chip RF IN RF OUT
Ground Back of Chip
Gate Supply Vg1
Gate Supply Vg2
Gate Supply Vg3
Gate Supply Vg4
Characteristic performance data and specifications are subject to change without notice. www.raytheon.com/micro Revised January 15, 2001 Page 2 Raytheon RF Components 362 Lowell Street Andover, MA 01810
RMDA1840
18-40 GHz Broad Band Driver Amplifier MMIC PRODUCT INFORMATION
Figure 2 Chip Layout and Bond Pad Locations Chip Size is 4.67 mm x 2.0 mm x 100 m. Back of chip is RF and DC ground
1.06 0.83 0.60
Dimensions in mm
1.50
2.44
3.16
4.15
4.57
2.00
0.0 0.0 0.11 1.23 2.35 3.22 3.84 4.67
Figure 3 Recommended Application Schematic Circuit Diagram
10,000pF
Drain Supply Vd = +5 V L L
L = Bond Wire Inductance
10,000pF
100pF
L 100pF L
L
L
L 100pF
L
100pF L
L
MMIC Chip RF IN Ground (Back of Chip) RF OUT
L
L 100pF
L 100pF L
L 100pF
100pF
L
L
L
10,000pF
L Gate Supply Vg
L
10,000pF
Note: For output power level detection, bias both detector and reference diodes. DC voltage difference between detector and reference can be used to measure output power after calibration. If output power level detection is not desired, do not make connection to detector bond pad. Characteristic performance data and specifications are subject to change without notice. www.raytheon.com/micro Revised January 15, 2001 Page 3 Raytheon RF Components 362 Lowell Street Andover, MA 01810
RMDA1840
18-40 GHz Broad Band Driver Amplifier MMIC PRODUCT INFORMATION
Figure 4 Recommended Assembly Diagram
Vd (Positive) 10,000pF Die-Attach 80Au/20Sn 100pF 100pF 100pF 100pF 10,000pF
5mil Thick Alumina 50-Ohm
5 mil Thick Alumina 50-Ohm RF Output
RF Input
100pF 2 mil Gap
100pF
100pF
100pF
10,000pF
Vg (Negative) 10,000pF
L< 0.015" (4 Places)
Note Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief. If output power level detection is not desired, do not make connection to detector bond pad.
Characteristic performance data and specifications are subject to change without notice. www.raytheon.com/micro Revised January 15, 2001 Page 4 Raytheon RF Components 362 Lowell Street Andover, MA 01810
RMDA1840
18-40 GHz Broad Band Driver Amplifier MMIC PRODUCT INFORMATION
Performance Data
Pout vs. Pin Vd = 5V, Id = 400mA
27 25 Pout (dBm) 23 18 GHz 21 19 17 15 -6 -4 -2 0 2 4 Pin (dBm) 29 GHz 40 GHz
Gain vs. Pin Vd = 5V, Id = 400mA
23 22.5 22 Gain (dB) 21.5 21 20.5 20 19.5 19 -6 -4 -2 0 2 4 Pin (dBm) 18 GHz 29 GHz 40 GHz
Characteristic performance data and specifications are subject to change without notice. www.raytheon.com/micro Revised January 15, 2001 Page 5 Raytheon RF Components 362 Lowell Street Andover, MA 01810
RMDA1840
18-40 GHz Broad Band Driver Amplifier MMIC PRODUCT INFORMATION
Performance Data
30 28 Pin = -5 dBm
Gain vs. Frequency Power In = -5, 0, +5 dBm Vd = 5V, Id = 400mA
Gain (dB) Power Out (dBm)
26 24 22 20 18 16 18 20 22 24 26 28 30 32 34 36 38 40 Frequency (GHz) Pin = 0 dBm Pin = +5 dBm
S21, S11, S22 Mag vs. Frequency Vd = 5V, Id = 400mA
30 S21 S21, S11, S22 Mag (dB) 20 10 0 -10 -20 -30 18 20 22 24 26 28 30 32 34 36 38 40 Frequency (GHz) S22 S11
Characteristic performance data and specifications are subject to change without notice. www.raytheon.com/micro Revised January 15, 2001 Page 6 Raytheon RF Components 362 Lowell Street Andover, MA 01810
Worldwide Sales Representatives
PRODUCT INFORMATION
North America
D&L Technical Sales 6139 S. Rural Road, #102 Tempe, AZ 85283 480-730-9553 fax: 480-730-9647 Nicholas Delvecchio, Jr. dlarizona@aol.com Hi-Peak Technical Sales P.O. Box 6067 Amherst, NH 03031 866-230-5453 fax: 603-672-9228 sales@hi-peak.com
Spartech South 2115 Palm Bay Road, NE, Suite 4 Palm Bay, FL 32904 321-727-8045 fax: 321-727-8086 Jim Morris jim@spartech-south.com
TEQ Sales, Inc. 920 Davis Road, Suite 304 Elgin, IL 60123 847-742-3767 fax: 847-742-3947 Dennis Culpepper dculpepper@teqsales.com
Cantec Representatives 8 Strathearn Ave, No. 18 Brampton, Ontario Canada L6T 4L9 905-791-5922 fax: 905-791-7940 Dave Batten cantec-ott@cantec-o.net
Steward Technology 6990 Village Pkwy #206 Dublin, CA 94568 925-833-7978 fax: 925-560-6522 John Steward johnsteward1@msn.com
Europe
Sangus OY Lunkintie 21, 90460 Oulunsalo Finland 358-8-8251-100 fax: 358-8-8251-110 Juha Virtala juha.virtala@sangus.fi
Sangus AB Berghamnvagen 68 Box 5004 S-165 10 Hasselby Sweden Ronny Gustafson 468-0-380210 fax: 468-0-3720954
Globes Elektronik & Co. Klarastrabe 12 74072 Heilbronn Germany 49-7131-7810-0 fax: 49-7131-7810-20 Ulrich Blievernicht hfwelt@globes.de
MTI Engineering Ltd. Afek Industrial Park Hamelacha 11 New Industrial Area Rosh Hayin 48091 Israel 972-3-902-5555 fax: 972-3-902-5556 Adi Peleg adi_p@mti-group.co.il
Sirces srl Via C. Boncompagni, 3B 20139 Milano Italy 3902-57404785 fax: 3902-57409243 Nicola Iacovino nicola.iacovino@sirces.it
Asia
ITX Corporation 2-5, Kasumigaseki 3-Chome Chiyoda-Ku Tokyo 100-6014 Japan 81-3-4288-7073 fax: 81-3-4288-7243 Maekawa Ryosuke maekawa.ryosuke@ itx-corp.co.jp Headquarters 6321 San Ignacio Drive San Jose, CA 95119 408-360-4073 fax: 408-281-8802 Art Herbig art.herbig@avnet.com
Sea Union 9F-1, Building A, No 19-3 San-Chung Road Nankang Software Park Taiwan, ROC Taipei 115 02-2655-3989 fax: 02-2655-3918 Murphy Su murphy@seaunionweb.com.tw France 4 Allee du Cantal Evry, Cedex France 33 16079 5900 fax: 33 16079 8903 sales.fr@ bfioptilas.avnet.com Holland Chr. Huygensweg 17 2400 AJ ALPHEN AAN DEN RIJN The Netherlands 31 172 446060 fax: 33 172 443414 sales.nl@ bfioptilas.avnet.com Spain C/Isobel Colbrand, 6 - 4a 28050 Madrid Spain 34 913588611 fax: 34 913589271 sales.es@ bfioptilas.avnet.com
Worldwide Distribution
United Kingdom Burnt Ash Road Aylesford, Kent England ME207XB 44 1622882467 fax: 44 1622882469 Belgium and Luxembourg rfsales.uk@ bfioptilas.avnet.com Cipalstraat 2440 GEEL Belgium 32 14 570670 fax: 32 14 570679 sales.be@bfioptilas.avnet.com
Sales Office Headquarters
United States (East Coast) Raytheon 362 Lowell Street Andover, MA 01810 978-684-8628 fax: 978-684-8646 Walter Shelmet wshelmet@ rrfc.raytheon.com
United States (West Coast) Raytheon 362 Lowell Street Andover, MA 01810 978-684-8919 fax: 978-684-8646 Rob Sinclair robert_w_sinclair@ rrfc.raytheon.com
Europe Raytheon AM Teckenberg 53 40883 Ratingen Germany 49-2102-706-155 fax: 49-2102-706-156 Peter Hales peter_j_hales@ raytheon.com
Asia Raytheon Room 601, Gook Je Ctr. Bldg 191 Hangang Ro 2-GA Yongsan-Gu, Seoul, Korea 140-702 82-2-796-5797 fax: 82-2-796-5790 T.G. Lee tg_lee@ rrfc.raytheon.com
Customer Support
www.raytheon.com/micro
978-684-8900
fax: 978-684-5452
customer_support@rrfc.raytheon.com
Characteristic performance data and specifications are subject to change without notice. Revised January 15, 2001 Page 7 Raytheon RF Components 362 Lowell Street Andover, MA 01810

▲Up To Search▲

Price & Availability of RMDA1840

	To Download RMDA1840 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .